Development of lead-free(Sn-Ag-Bi-Cu) Solder bumps by Electroplating process by Shany Joseph
Material type: BookSeries: IISc, Dept. of MRC, MSc(Engg)thesisPublication details: Bangalore Indian Institute of Science 2003Description: ix, 143pSubject(s): DDC classification:- 671.732 P03 "THESIS"
Item type | Current library | Call number | Status | Date due | Barcode |
---|---|---|---|---|---|
Thesis | JRD Tata Memorial Library | 671.732 P03 "THESIS" (Browse shelf(Opens below)) | Available | T05477 |
There are no comments on this title.