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Development of lead-free(Sn-Ag-Bi-Cu) Solder bumps by Electroplating process

Joseph, Shany

Development of lead-free(Sn-Ag-Bi-Cu) Solder bumps by Electroplating process by Shany Joseph - Bangalore Indian Institute of Science 2003 - ix, 143p. - IISc, Dept. of MRC, MSc(Engg)thesis .

Dewey Class. No.: 671.732 / P03 "THESIS"

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