Handbook of Wafer Bonding

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Material type: Text

TextPublication details: Germany: Wiley VCH, 2012.Description: xxxi, 395pISBN:

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Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Book	Centre for Nano Science and Engineering	621.38152 P124 (CeNSE) (Browse shelf(Opens below))	Available		191458

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Previous	621.38152 P078 (CeNSE) Science and Engineering of Microeletronic Fabrication	621.38152 P086 (CeNSE) Epitaxial growth of nitrides on germanium	621.38152 P12 (CeNSE) Broadband optical modulators Science technology and applications	621.38152 P124 (CeNSE) Handbook of Wafer Bonding	621.38152 P125 (CeNSE) Semiconductor Packaging Materials Interaction and Reliability	621.38152 P14 (CeNSE) Nanostructured semiconductors From basic research to applications	621.38152 P143 (CeNSE) Integration of functional oxides with semiconductors	Next

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