Handbook of Wafer Bonding (Record no. 180317)

MARC details
000 -LEADER
fixed length control field 00508nam a2200169Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 240118b |||||||| |||| 008| 0 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9783527326464
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.38152
Item number P124 (CeNSE)
245 ## - TITLE STATEMENT
Title Handbook of Wafer Bonding
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
Place of publication, distribution, etc Germany:
Name of publisher, distributor, etc Wiley VCH,
Date of publication, distribution, etc 2012.
300 ## - PHYSICAL DESCRIPTION
Extent xxxi, 395p.
700 ## - ADDED ENTRY--PERSONAL NAME
Personal name Ramm, Peter., ed
700 ## - ADDED ENTRY--PERSONAL NAME
Personal name Jian-Qiang Lu, James., ed
700 ## - ADDED ENTRY--PERSONAL NAME
Personal name Maaike M V., ed
852 ## - LOCATION/CALL NUMBER
Piece designation 191458
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Source of classification or shelving scheme Dewey Decimal Classification
Item type Book

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