Handbook of Wafer Bonding (Record no. 180317)
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000 -LEADER | |
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fixed length control field | 00508nam a2200169Ia 4500 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 240118b |||||||| |||| 008| 0 eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
International Standard Book Number | 9783527326464 |
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
Classification number | 621.38152 |
Item number | P124 (CeNSE) |
245 ## - TITLE STATEMENT | |
Title | Handbook of Wafer Bonding |
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
Place of publication, distribution, etc | Germany: |
Name of publisher, distributor, etc | Wiley VCH, |
Date of publication, distribution, etc | 2012. |
300 ## - PHYSICAL DESCRIPTION | |
Extent | xxxi, 395p. |
700 ## - ADDED ENTRY--PERSONAL NAME | |
Personal name | Ramm, Peter., ed |
700 ## - ADDED ENTRY--PERSONAL NAME | |
Personal name | Jian-Qiang Lu, James., ed |
700 ## - ADDED ENTRY--PERSONAL NAME | |
Personal name | Maaike M V., ed |
852 ## - LOCATION/CALL NUMBER | |
Piece designation | 191458 |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Source of classification or shelving scheme | Dewey Decimal Classification |
Item type | Book |
No items available.