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	1.	Electronic materials and processes handbook ed. by Charles A. Harper, Ronald N. Sampson by Harper, Charles A., ed Sampson, Ronald N., ed Series: Electronic Packaging and Interconnection Series Edition: 2nd Material type: Book Publication details: New York McGraw-Hill 1994 Availability: Items available for reference: JRD Tata Memorial Library: Not for loan (1)Call number: 621.381 N943 "R".
	2.	Ball grid array technology ed. by John H. Lau by Lau, John H., ed Series: Electronic Packaging and Interconnection Series Material type: Book Publication details: New York McGraw-Hill 1995 Availability: Items available for reference: Electronic Systems Engineering: Not for loan (1)Call number: 621.381046 N952.
	3.	Plastics for electronics Materials, properties, and design applications. by William M. Alvino by Alvino, William M Series: Electronic Packaging and Interconnection Series Material type: Book Publication details: New York McGraw-Hill 1995 Availability: Items available for reference: Electronic Systems Engineering: Not for loan (1)Call number: 620.1920246213 N95.
	4.	Thin Film Technology Handbook by Aicha A R Elshabini-Riad and Fred D Barlow III by Elshabini-Riad, Aicha A R Barlow III, Fred D Series: Electronic Packaging and Interconnection series Material type: Book Publication details: New York McGraw-Hill 1998 Availability: Items available for loan: JRD Tata Memorial Library (1)Call number: 621.38152 N987 "R". Place hold

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