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	1.	Fundamentals of microsystems packaging ed by Rao R. Tummala by Tummala, Rao R.,ed Material type: Text Publication details: New York McGraw Hill 2001 Availability: Items available for loan: JRD Tata Memorial Library (1)Call number: 621.381046 P01. Place hold
	2.	Microelectronics packaging handbook- part I ed by Rao R. Tummala, Eugene J. Rymaszewski and Alan G. Klopfenstein by Tummala, Rao R., ed Rymaszewski, Eugene J., ed Klopfenstein, Alan G., ed Edition: 2nd ed. Material type: Text Publication details: Boston Kluwer Academic Publishers 1997 Availability: Items available for loan: JRD Tata Memorial Library (1)Call number: 621.381046 N97.1 . Place hold
	3.	Microelectronics packaging handbook semiconductor packaging:v.2 ed by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein by Tummala, Rao R., ed Rymaszewski, Eugene J., ed Klopfenstein, Alan G., ed Edition: 2nd ed. Material type: Text Publication details: Boston Kluwer Academic Publishers 1997 Availability: Items available for loan: JRD Tata Memorial Library (1)Call number: 621.381046 N97.2 . Place hold
	4.	Microelectronics packaging handbook by Tummala, Rao R., ed Rymaszewski, Eugene J., ed Klopfenstein, Alan G., ed Edition: 2nd ed. Material type: Text; Format: print ; Literary form: Not fiction Publication details: Boston Kluwer Academic Press 1997 Availability: Items available for loan: JRD Tata Memorial Library (1)Call number: 621.381046 N97.3 . Place hold

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