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Electronics packaging forum: multichip module technology issue /ed. by James E. Morris by
  • Morris, James E
Material type: Text Book
Publication details: Piscataway IEEE Press 1994
Availability: Items available for reference: Electronic Systems Engineering: Not for loan (1)Call number: 621.381046 N94.

2.
Nanopackaging Nanotechnologies and Electronics Packaging ed by Morris E James by
  • Morris, James E. ed
Material type: Text Book
Publication details: USA Springer 2008
Availability: Items available for loan: Electronic Systems Engineering (1)Call number: 621.381046 P08 (CEDT).

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3.
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Nano packaging: Nanotechnologies and electronics packaging ed by James E Morris by
  • Morris, James E
Material type: Text Book
Publication details: USA Springer 2008
Availability: Items available for loan: JRD Tata Memorial Library (1)Call number: 621.381046 P08;1.

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