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	1.	Integrated circuit, hybrid and multichip module package design guidelines: a focus on reliability /Michael Pecht by Pecht, Michael Material type: Text Publication details: New York JW 1994 Availability: Items available for reference: Electronic Systems Engineering: Not for loan (1)Call number: 621.381046 N941.
	2.	Quality conformance and qualification of microelectronic packages and interconnects ed. by Michael pecht, Abhijit Dasgupta, John W Evans by Pecht, Michael., ed Dasgupta, Abhijit., ed Evans, John W., ed Material type: Text Publication details: New York John Wiley 1994 Availability: Items available for reference: Electronic Systems Engineering: Not for loan (1)Call number: 621.381046 N944.
	3.	Prognostics and health management of electronics by Michael G Pecht by Pecht, Michael G Material type: Text Publication details: New Jersey Wiley 2008 Availability: Items available for loan: JRD Tata Memorial Library (1)Call number: 621.3810288 P08. Place hold
	4.	Lead-free electronics ed by Sanka Ganesan and Michael Pecht by Ganesan, Sanka., ed Pecht, Michael., ed Material type: Text Publication details: New Jersey Wiley-Interscience 2006 Availability: Items available for loan: Electronic Systems Engineering (1)Call number: 621.3815 P061(CEDT). Place hold
	5.	Product reliability maintainability and supportability handbook ed by Michael Pecht by Pecht, Michael., ed Edition: 2nd ed Material type: Text Publication details: Boca Raton CRC Press 2009 Availability: Items available for loan: Centre for Product Design and Manufacturing (1)Call number: 658.575 P091 (CPDM). Place hold

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