MEMS Packaging   
ed by Tai-Ran Hsu 
 - London  INSPEC  2003 
 - xxix, 275p. 
 - EMS Processing Series  3  EMIS Data reviews series .
<br/><br/><label>ISBN: </label>9780863413353 
<br/><br/><label>Dewey Class. No.: </label>621.381  / P047 (CeNSE)