TY  - BOOK
AU  - Ramm, Peter., ed
AU  - Jian-Qiang Lu, James., ed
AU  - Maaike M V., ed
TI  - Handbook of Wafer Bonding
SN  - 9783527326464
U1  - 621.38152 
PY  - 2012///
CY  - Germany
PB  - Wiley VCH
ER  -