Lau, John H <br/><br/>
Through-Silicon VIAS for 3D Integration   
by John H Lau 
 - New York  McGraw Hill  2013 
 - xxiv, 487p. 
<br/><br/><label>ISBN: </label>9780071785143 
<br/><br/><label>Dewey Class. No.: </label>621.38153  / P13 (CeNSE)