TY  - BOOK
AU  - Joseph, Shany
TI  - Development of lead-free(Sn-Ag-Bi-Cu) Solder bumps by Electroplating process
T2  - IISc, Dept. of MRC, MSc(Engg)thesis
U1  - 671.732 
PY  - 2003///
CY  - Bangalore
PB  - Indian Institute of Science
ER  -