Joseph, Shany <br/><br/>
Development of lead-free(Sn-Ag-Bi-Cu) Solder bumps by Electroplating process   
by Shany Joseph 
 - Bangalore  Indian Institute of Science  2003 
 - ix, 143p. 
 - IISc, Dept. of MRC, MSc(Engg)thesis .
<br/><br/><label>Dewey Class. No.: </label>671.732  / P03 "THESIS"