TY  - BOOK
AU  - Tummala, Rao R., ed.,
AU  - Rymaszewski, Eugene J., ed.,
AU  - Klopfenstein, Alan G., ed.,
TI  - Microelectronics packaging handbook
SN  - 0412084511
U1  - 621.381046 
PY  - 1997///
CY  - Boston
PB  - Kluwer Academic Press
ER  -