TY  - BOOK
AU  - IEEE Electronic components and technology conference (43: 1993: Orlando)
TI  - Electronic components and technology conference. ECTC 1993: Proceedings
SN  - 078030795X
U1  - 621.3813306 
PY  - 1993///
CY  - New York
PB  - IEEE
KW  - ECTC 1993; Modeling & simulation; Manufacturing technology; Electronic packaging; IEEE components, packaging & manufacturing technology society
ER  -