Electronic components and technology conference. ECTC 1993  Proceedings 

 - New York  IEEE  1993 
 - xviii, 1166p  incl. bibl. 
<br/><br/><label>ISBN: </label>078030795X 
<br/><br/><label>Subjects--Index Terms: </label>ECTC 1993; Modeling & simulation; Manufacturing technology; Electronic packaging; IEEE components, packaging & manufacturing technology society 
<br/><br/><label>Dewey Class. No.: </label>621.3813306  / N93 "SER"