Electronics componenets and technology. ECTC 1991  Proceedings 

 - New York  IEEE  1991 
 - xvi, 900p  incl. bibl. 
<br/><br/><label>ISBN: </label>0780300130 
<br/><br/><label>Subjects--Index Terms: </label>ECTC 1991; Modeling & simulation; manufacturing technology; electronic packaging; IEEE Components, packaging & manufacturing Technology Society 
<br/><br/><label>Dewey Class. No.: </label>621.3813306  / N91 "SER"