Semiconductor Packaging Materials Interaction and Reliability by Andrea Chen and Randy Hsiao Yu Lo

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TextPublication details: Boca Raton Taylor & Francis 2012Description: xviii, 198pISBN:

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Item type	Current library	Call number	Status	Date due	Barcode
Book	Centre for Nano Science and Engineering	621.38152 P125 (CeNSE) (Browse shelf(Opens below))	Available		192109

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