Three Dimensional System Integration IC Stacking Process and Design ed by Antonis Papanikolaou, Dimitrios Soudris & R Radojcic

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BookPublication details: London Springer 2011Description: viii, 246pISBN:

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Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Book	Centre for Nano Science and Engineering	621.3815 P111 (CeNSE) (Browse shelf(Opens below))	Available		192043

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Previous	621.3815 P06;3 (CeNSE) Solid state electronic devices	621.3815 P06;4 (CeNSE) Solid state electronic devices	621.3815 P104 (CeNSE) Wire Bonding in Microelectronics	621.3815 P111 (CeNSE) Three Dimensional System Integration IC Stacking Process and Design	621.3815 P142 (CeNSE) Silicon on insulator (SOI) Technology	621.38152 N9510;1 (CeNSE) Thin-Film Deposition Principles and Practice	621.38152 N96 (CeNSE) Semiconductor device fundamentals	Next

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