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Through-Silicon VIAS for 3D Integration by John H Lau
Material type:
TextPublication details: New York McGraw Hill 2013Description: xxiv, 487pISBN: - 9780071785143
- 621.38153 P13 (CeNSE)
| Item type | Current library | Call number | Status | Date due | Barcode | |
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Centre for Nano Science and Engineering | 621.38153 P13 (CeNSE) (Browse shelf(Opens below)) | Available | 192339 |
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| 621.38152 P15 (CeNSE) Handbook of silicon based MEMS materials and technologies | 621.381528 P096 (CeNSE) Advanced power rectifier Concepts | 621.38153 P111 (CeNSE) 3D IC Stacking Technology | 621.38153 P13 (CeNSE) Through-Silicon VIAS for 3D Integration | 621.381531 P13(CeNSE) Stretchable electronics | 621.3815324 P083 (CeNSE) Design of Analog Filters: | 621.381533 P09 (CeNSE) Phase noise and frequency stability in oscillators |
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