Characterization of integrated circuit packaging materials ed by Thomas M Moore and Robert G Mckenna

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Material type: Book

BookSeries: Materials characterization seriesPublication details: New York Momentum press 2010Description: xx, 274pISBN:

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Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Book	Electronic Systems Engineering	621.381046 P101 (DESE) (Browse shelf(Opens below))	Available		189420

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Previous	621.381 P153;1 (ESE) Electronic devices: Conventional current version	621.381046 N94 Electronics packaging forum: multichip module technology issue /ed. by James E. Morris	621.381046 P08 (CEDT) Nanopackaging Nanotechnologies and Electronics Packaging	621.381046 P101 (DESE) Characterization of integrated circuit packaging materials	621.3813 P033 (ESE) Microwave devices and circuits	621.3815 N979 (CEDT) Application-specific integrated circuits	621.3815 N979;2 (DESE) Application Specific Integrated Circuits	Next

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