Stress-induced phenomena in metallization (Record no. 146779)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00604nam a2200193Ia 4500 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 0735403104 |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 667.9 |
| Item number | P06 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | International workshop on stress-induced phenomena in metallization (8 |
| Numeration | 2005 |
| -- | Dresden) |
| 245 ## - TITLE STATEMENT | |
| Title | Stress-induced phenomena in metallization |
| Remainder of title | |
| Statement of responsibility, etc. | ed by Ehrenfried Zschech, et al., |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. | |
| Place of publication, distribution, etc. | Melville |
| Name of publisher, distributor, etc. | American institute of physics |
| Date of publication, distribution, etc. | 2006 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | xi, 372p. |
| Other physical details | incl. bibl. |
| 490 ## - SERIES STATEMENT | |
| Series statement | AIP Conference proceedings. Vol.817 |
| 690 ## - LOCAL SUBJECT ADDED ENTRY--TOPICAL TERM (OCLC, RLIN) | |
| Topical term or geographic name as entry element | Electronic materials; Reliability device; Materials analysis; Solder joints - stress; Stress - induced phenomena; On-chip interconnect structures; Technology integration; American institute of physics; |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Zschech, Ehrenfried. ed. et al |
| 919 ## - | |
| -- | 152332 |
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