Normal view MARC view ISBD view

Microelectronics packaging handbook subsystem packaging:v.3

Microelectronics packaging handbook - 2nd ed. - Boston Kluwer Academic Press 1997 - xxix, 628p.

ISBN: 0412084511

Dewey Class. No.: 621.381046 / N97.3

Place hold
Print
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)