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Through-Silicon VIAS for 3D Integration by John H Lau

By: Material type: TextTextPublication details: New York McGraw Hill 2013Description: xxiv, 487pISBN:
  • 9780071785143
Subject(s): DDC classification:
  • 621.38153 P13 (CeNSE)
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Item type Current library Call number Status Date due Barcode
Book Book Centre for Nano Science and Engineering 621.38153 P13 (CeNSE) (Browse shelf(Opens below)) Available 192339

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